The residual stress of the zirconia film on a stainless steel substrate is measured using the digital image correlation (DIC) method. A lattice structure is milled by focused ion beam (FIB) and used as the deformation carrier. An annular groove is etched by FIB in order to release the residual stress. The DIC method is used to calculate the deformation caused by the release of residual stress and the residual stress is derived by mechanics equations. The results demonstrate that this method can be extended for micro-region residual stress measurement of other thin films on substrates.
| Published in |
Optics (Volume 4, Issue 3-1)
This article belongs to the Special Issue Optical Techniques for Deformation, Structure and Shape Evaluation |
| DOI | 10.11648/j.optics.s.2015040301.17 |
| Page(s) | 29-32 |
| Creative Commons |
This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited. |
| Copyright |
Copyright © The Author(s), 2015. Published by Science Publishing Group |
Digital Image Correlation (DIC), Focused Ion Beam (FIB), Residual Stress
| [1] | Tang W, Deng L J, Xu K W, et al. X-ray diffraction measurement of residual stress and crystal orientationin Au/NiCr/Ta films prepared by plating. Surface & Coatings Technology, 2007, 201:5944-5947. |
| [2] | Yang F, Fei W D, Gao Z M, et al. An alternative micro-area X-ray diffraction method for residual stress measurement of Pb(Zr,Ti)O3 film. Surface & Coatings Technology, 2007, 202: 121-125. |
| [3] | Kang Y L, Qiu Y, Lei Z K, et al. An application of Raman spectroscopy on the measurement of residual stress in porous silicon.Optics and Lasers in Engineering, 2005, 43: 847-855. |
| [4] | Zhu W L, Zhu J L, Nishino S, et al. Spatially resolved Raman spectroscopy evaluation of residual stresses in 3C-SiC layer deposited on Si substrates with different crystallographic orientation. Applied Surface Science, 2006, 252: 2346-2354. |
| [5] | Sabate N, Vogel D, Gollhardt A, et al. Residual stress measurement on a MEMS structure with high-spatial resolution. Journal of Microelectromechanical Systems, 2007, 16(2):365-372. |
| [6] | Sabate N, Vogel D, Gollhardt A, et al. Digital image correlation of nanoscale deformation fields for local stress measurement in thin films. Nanotechnology, 2006, 17(20):5264-5270. |
| [7] | Sabate N, Vogel D, Gollhardt A, et al. Measurement of residual stresses in micromachined structures in a microregion. Applied physics letters, 2006, 88:071910. |
| [8] | Massl S, Keckes J, Pippan R. A new cantilever technique reveals spatial distributions of residual stresses in near-surface structures. Scripta materialia, 2008, 59(5):503-506. |
| [9] | Korsunsky A, Sebastiani M,Bemporad E. Residual Stress Evaluation at the Micrometer Scale: Analysis of Thin Coatings by FIB milling and Digital Image Correlation. Surface and Coatings Technology, 2010, 205(7):2393-2403. |
| [10] | Korsunsky A, Sebastiani M, Bemporad E. Focused ion beam ring drilling for residual stress evaluation. Materials Letters, 2009, 63(22):1961-1963. |
| [11] | Sebastiani M, Eberl C, Bemporad E, et al. Depth-resolved residual stress analysis of thin coatings by a new FIB-DIC method. Materials Science & Engineering A, 2011, 528(27):7901-7908. |
| [12] | Zhu J G, Xie H M, Li Y J, et al. Interfacial Residual Stress Analysis of Thermal Spray Coatings by Miniature Ring-Core Cutting Combined with DIC Method. Experimental Mechanics, 2014, 54(2): 127-136. |
APA Style
Yanjie Li, Guang Han. (2015). Residual Stress Measurement in Micro-region Using Digital Image Correlation Method. Optics, 4(3-1), 29-32. https://doi.org/10.11648/j.optics.s.2015040301.17
ACS Style
Yanjie Li; Guang Han. Residual Stress Measurement in Micro-region Using Digital Image Correlation Method. Optics. 2015, 4(3-1), 29-32. doi: 10.11648/j.optics.s.2015040301.17
AMA Style
Yanjie Li, Guang Han. Residual Stress Measurement in Micro-region Using Digital Image Correlation Method. Optics. 2015;4(3-1):29-32. doi: 10.11648/j.optics.s.2015040301.17
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Download@article{10.11648/j.optics.s.2015040301.17,
author = {Yanjie Li and Guang Han},
title = {Residual Stress Measurement in Micro-region Using Digital Image Correlation Method},
journal = {Optics},
volume = {4},
number = {3-1},
pages = {29-32},
doi = {10.11648/j.optics.s.2015040301.17},
url = {https://doi.org/10.11648/j.optics.s.2015040301.17},
eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.optics.s.2015040301.17},
abstract = {The residual stress of the zirconia film on a stainless steel substrate is measured using the digital image correlation (DIC) method. A lattice structure is milled by focused ion beam (FIB) and used as the deformation carrier. An annular groove is etched by FIB in order to release the residual stress. The DIC method is used to calculate the deformation caused by the release of residual stress and the residual stress is derived by mechanics equations. The results demonstrate that this method can be extended for micro-region residual stress measurement of other thin films on substrates.},
year = {2015}
}
TY - JOUR T1 - Residual Stress Measurement in Micro-region Using Digital Image Correlation Method AU - Yanjie Li AU - Guang Han Y1 - 2015/09/02 PY - 2015 N1 - https://doi.org/10.11648/j.optics.s.2015040301.17 DO - 10.11648/j.optics.s.2015040301.17 T2 - Optics JF - Optics JO - Optics SP - 29 EP - 32 PB - Science Publishing Group SN - 2328-7810 UR - https://doi.org/10.11648/j.optics.s.2015040301.17 AB - The residual stress of the zirconia film on a stainless steel substrate is measured using the digital image correlation (DIC) method. A lattice structure is milled by focused ion beam (FIB) and used as the deformation carrier. An annular groove is etched by FIB in order to release the residual stress. The DIC method is used to calculate the deformation caused by the release of residual stress and the residual stress is derived by mechanics equations. The results demonstrate that this method can be extended for micro-region residual stress measurement of other thin films on substrates. VL - 4 IS - 3-1 ER -
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